作者：Gareth Powell
单位：Teledyne e2v
中图分类号：TP391.4                  
文献标识码：B                  
文章编号：1006-883X(2020)06-0039-06
收稿日期：2020-06-04

摘要：伴随着当今更低成本和更高性能的工业相机的趋势，对CMOS图像传感器也提出了更高的要求，需要通过设计系统级芯片（SoC）来实现这一目标。为实现该目标，需通过3D芯片堆栈和背照（Back Side Illuminated，BSI）技术，把多个图像处理任务集成到单一器件中。在未来将会出现具有精密的机器学习和专有的智能计算芯片结合图像撷取功能的解决方案，创造出紧凑的高速运算视觉系统。可是在实现崭新的大型技术集成之前，必需扫除两个主要发展障碍——芯片的热量管理和功耗。现在，先进的前照（Front Side Illuminated，FSI）CMOS传感器集成了模拟和数字功能，实现了成本和效能兼具的解决方案。能够达成这些目标，关键在于把有利于系统效能及嵌入到图像传感器SoC等各种因素的巧妙分隔。本文将介绍一款面向条形码读码器和其它嵌入式视觉应用的CMOS图像传感器系列产品、它们的应用实例，以及一些未来发展趋势。
关键词：条形码；阅读器；CMOS图像传感器

Application Focused Image Sensors for Industrial Barcode Scanners, with High Performance and Low Cost
Gareth Powell
Teledyne e2v
Abstract: With the constant drive for better and cheaper cameras for industrial imaging applications, CMOS image sensors can make use of unique System on Chip (SoC) features. It is possible, due to 3D chip stacking and Back-Side Illuminated (BSI) CMOS image sensors, to integrate many image processing tasks into a single device. The future will see sophisticated machine learning and dedicated intelligence, computed on-chip, while simultaneously grabbing images for compact, higher speed, computer vision systems. However, chip thermal management and power distribution are current obstacles that this new large-scale integration technology has to overcome. In the meantime, advanced Front Side Illuminated (FSI) CMOS sensors are integrating analog and digital features to provide economic and performance oriented solutions. The key to achieving these objectives comes from judicious partitioning of what is useful for system performance aspects and/or cheaper to embed in the image sensor SoC. This article will present an example of an application focused CMOS image sensor family for use in barcode scanning and other embedded vision applications, with examples of their use cases, and some future perspectives.
Key words: barcode; reading application; CMOS image sensor

阅读全文

备注：2020年 第26卷 第06期